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Epoxy Base Electronic Material Corporation Limited
Epoxy Base Electronic Material Corporation Limited
29 YRS
Guangdong, China
Main Products:
Bisphenol-A Epoxy Resin / Epoxy Resin
Guangdong, China
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Liquid Epoxy Resin - Workhorse Specification Series
Liquid Epoxy Resin - Dilution Series
Liquid Epoxy Resin - Pouring and APG Process Series
Liquid Epoxy Resin - Solvent Series
Powder Paint Specific Resins - Standard 900 Series
Powder Paint Specific Resins - Direct Type 300 Series
Powder Paint Specific Resins - MASTERBATCH Series
Special Resin for Tank Coating - Standard 900 Series
Special Resin for Tank Coating - Direct Type 300 Series
Copper Foil Substrate Dedicated Epoxy-FR4 Series
Special Resin for Tank Coating-Phenoxy Series
Copper Foil Substrate Dedicated Epoxy-UV Resistant Series
Liquid Epoxy Resin - Pouring and APG Process Series / CAS 25085-99-8
OVERVIEW
Packaging
200 KG/Plastic Drum
Lead Time
14-30 days
Max Capacity
155000 MT/Year
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Less than 1KG required
DESCRIPTION
Liquid Epoxy Resin
Pouring and APG process series
Typical Properties
Summary
CAS No.
25085-99-8
Formula
C21H24O4
Molecular Mass
340.41300
Exact Mass
340.16700
PSA
43.52000
Logp
3.56770
IUPAC
2-[[4-(oxiran-2-ylmethoxy)-2-prop-1-en-2-ylphenoxy]methyl]oxirane
SMILES
CC(=C)C1=C(C=CC(=C1)OCC2CO2)OCC3CO3
Attribute classification
Matter Classification
organic
Category
Polymers Material > Others
Coating(Resin) > Epoxy Paint
Coating(Resin) > Epoxy Paint
Chemical and Physical Properties
Melting Point
45-55 °C
Density
1.16 g/cm3(Temp: 25 °C)
Appearance
Solid or liquid
Export information
HS Code
39073000
Export Rebate
13%
Export Formalities
A
M
UN No.
0.0
DG-Class
0.0
Risk Code
43
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