High molecular compounds containing epoxy groups in their molecular structures are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metallic materials, good dielectric properties, small variable shrinkage, good dimensional stability of products, high hardness, good flexibility and stability to alkali and most solvents. Therefore, it is widely used in various departments of national defense and national economy for pouring, impregnation, lamination Adhesive, coating and other uses.
CAS No.
61788-97-4
Formula
C21H23ClFNO2
Molecular Mass
375.86400
Exact Mass
375.14000
PSA
29.54000
Logp
4.75120
Attribute classification
Category
Chemical and Physical Properties
Melting Point
相对分子质量为600时熔点40℃
Appearance
Uncured resins are longchained prepolymers that are viscous liquids or solids; the cured resins are strong, solid polymers
Export information
HS Code
29211990
UN No.
0
DG-Class
0
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