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CAS:768-35-4
Molecular Formula:C6H6BFO2
(3-Fluorophenyl)Boronic acid; 3-Fluorobenzeneboronic acid; m-Fluorophenylboronic acid; 3-Fluorophenyl Boronic acid; 3-Fluoro Phenylboric acid; (3-Fluorophenyl)Boranediol; m-Fluorobenzeneboronic acid
Brief Introduction
3-fluorophenylboric acid is an important pharmaceutical and chemical intermediate, which is widely used in organic and pharmaceutical synthesis. In addition to its important application in Suzuki coupling reaction, it has other applications: for example, it is used as a catalyst to catalyze the condensation of carboxylic acid and amine, and catalyze the reduction of carboxylic acid to alcohol; And α,β- Unsaturated compounds were synthesized by 1,4-conjugate addition reaction β- Aryl substituted carbonyl compounds, etc.
CNY 3.3 Million
66600m²
100-500 People
Manufacturing Manufacturing
Product Photo Specification Grade Max Capacity Certificates Package
≥99.5% Tech Grade 240 tons/year -
20kg / Fibre Drum
Main products:
3-Fluorophenylboronic Acid /Phenylboronic Acid /4-Methylphenylboronic acid /2-Chlorophenylboronic Acid
CAS:92-06-8
Molecular Formula:C18H14
1,3-Diphenylbenzene; 1,1':3',1''-Terphenyl; Isodiphenylbenzene; 1,3-Terphenyl; m-Diphenylbenzene; meta-Terphenyl
Brief Introduction
Usually with excellent optoelectronic and optical properties, m-terpenes have been widely used in materials science to create conducting polymers, liquid crystal materials, heat storage and heat transfer materials, laser dyes and textile dye carriers, among others.
CNY 45 Million
75258m²
Less Than 50 People
Manufacturing Manufacturing
Product Photo Specification Grade Max Capacity Certificates Package
≥99.9% Tech Grade 100 tons/year -
25kg / Paper Bag
Main products:
M-Terphenyl /Biphenyl /Cyclohexylbenzene /P-Terphenyl /2,3-Diisopropylbiphenyl
temp-1; Alkynyl Ethers
Brief Introduction
Intermediate for electroplating, leveling agent in forged nickel and bright nickel plating solution
CNY 11.9 Million
143190m²
Less Than 50 People
Manufacturing Manufacturing
Product Photo Specification Grade Max Capacity Certificates Package
PH: 4~7; Density: 1.11~1.15 kg/L Tech Grade - -
25kg / Plastic Drum
200kg / Plastic Drum
Main products:
Alkynols and Ethers Polymer /Chloral Hydrate /1H-Imidazole, Polymer with (Chloromethyl)Oxirane /N-Benzylniacin /1-Benzyl-3-Carboxylatopyridinium Sodium Chloride /Quaternary Ammonium Salt PyC
CAS:83048-65-1
Molecular Formula:C13H13F17O3Si
(3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-Heptadecafluorodecyl)Trimethoxysilane; (Heptadecafluoro-1,1,2,2-Tetrahydrodecyl)Trimethoxysilane; Trimethoxy(1H,1H,2H,2H-Heptadecafluorodecyl)Silane; 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-Heptadecafluorodecyl(Trimethoxy)Silane; Silane, (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-Heptadecafluorodecyl)Trimethoxy-
Brief Introduction
This product can be used for the coating of electronic products, for the self-cleaning of glass and other products, so that the substrate can prevent light reflection. It can also be used to prepare wear-resistant ultra moisture resistant nylon surface. It can also be used as an additive to increase the hydrophobicity of the surface of carbon nanotube structure.
CAS:12007-23-7
Molecular Formula:B2H4Hf-
Hafnium Boride,HFB(2); CID 6336857; Dtxsid10893925; Einecs 234-500-7; Hafnium Boride Powder; Hafnium Boride, 99.5% (Metals Basis Excluding Zr), Zr <2%; Hafnium Boride Powder (HfB2); Hafnium Diboride
Brief Introduction
Hafnium diboride is an ultrahigh temperature ceramic composed of hafnium and boron. It has a melting temperature of about 3250 degrees Celsius. It is an unusual ceramic, having relatively high thermal and electrical conductivities, properties it shares with isostructural titanium diboride and zirconium diboride. It is a grey, metallic looking material. Hafnium diboride has a hexagonal crystal structure, a molar mass of 200.11 grams per mole, and a density of 10.5 grams per cubic centimeter. Hafnium diboride is often combined with carbon, boron, silicon, silicon carbide, and/or nickel to improve the consolidation of the hafnium diboride powder (sintering). It is commonly formed into a solid by a process called hot pressing, where the powders are pressed together using both heat and pressure. The material has potential for use in hypervelocity reentry vehicles such as ICBM heat shields or aerodynamic leading-edges, due to its strength and thermal properties. Unlike polymer and composite material, HfB2 can be formed into aerodynamic shapes that will not ablate during reentry. Hafnium diboride is also investigated as a possible new material for nuclear reactor control rods. It is also being investigated as a microchip diffusion barrier. If synthesized correctly, the barrier can be less than 7nm thick.
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