CAS:10043-35-3
Molecular Formula:BH3O3
Alias
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Orthoboric acid; Boracic acid; Boric; Boracic; Borsaure; Boric acid,Dnase,Rnase and Protease free; Borsure; Sassoline BH3O3,Sassolite; Borofax; TBE Buffer; Fleaprufe; Asam Borat; Asam Boric
Brief Introduction
It is used to prepare borate, borate ester, optical glass, paint, pigment, boric acid soap, leather finishing agent, printing and dyeing auxiliaries and disinfectants in medicine
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CAS:1310-58-3
Molecular Formula:KOH
Alias
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Caustic Potash; Caustic; Potash Caustic; Potassium Hydrate; Potassium Hyroxide; KOH; Potassium Hydroxide KOH; Caustic Potash Flakes; Caustic Potash Solid; Potassium Hydroxide Flakes; Potassium Hydroxside; Potassium Hydroxide 90%
Brief Introduction
Potassium hydroxide, also known as lye is an inorganic compound with the chemical formula KOH. Also commonly referred to as caustic potash, it is a potent base that is marketed in several forms including pellets, flakes, and powders. It is used in various chemical, industrial and manufacturing applications. Potassium hydroxide is also a precursor to other potassium compounds. Potassium hydroxide is used in food to adjust pH, as a stabilizer, and as a thickening agent. This ingredient has been considered as generally safe as a direct human food ingredient by the FDA, based upon the observance of several good manufacturing practice conditions of use. In addition to the above uses, potassium hydroxide is also used in making soap, as an electrolyte in alkaline batteries and in electroplating, lithography, and paint and varnish removers. Liquid drain cleaners contain 25 to 36% of potassium hydroxide. Medically, potassium hydroxide (KOH) is widely used in the wet mount preparation of various clinical specimens for microscopic visualization of fungi and fungal elements in skin, hair, nails, and even vaginal secretions,. Recently, it has been studied for efficacy and tolerability in the treatment of warts. It was determined that topical KOH solution was found to be a safe and effective treatment of plane warts.
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Huarong Chemical (Chengdu) Co.,Ltd.
Assay≥90%
/
Tech Grade
25kg
/
Woven Bag
CAS:7664-39-3
Molecular Formula:HF
Alias
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Fluorhydric acid; Hydrofluric Acid; Hydroflouric acid; Fluoreto de Hidrogênio; HF acid; Fluorane; Hydrofluoride; Fluorwasserstoff; AHF; Acide Fluorhydrique; Hydrogen Fluoride Anhydrous; Hydrofluoric acid; Hydro Floric; Hydrofluoric
Brief Introduction
It is used in the manufacture of organic or inorganic fluoride, such as fluorocarbon, sodium fluoride, aluminum fluoride, uranium hexafluoride and cryolite. It is also used for pickling of stainless steel and non-ferrous metals, engraving and lettering of glass instrument scales, glassware and mirrors, polishing of glassware, treatment of frosted bulbs and general bulbs, silicon removal and purification of metal graphite emulsion, sand removal of metal castings, removal of graphite ash, and manufacturing of Semiconductors (germanium and silicon). It is also used as a catalyst for dye synthesis and other organic synthesis. It is also used in electroplating, reagent, fermentation, ceramic treatment and the manufacture of fluororesin and flame retardant.
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EL/UP/UP-S/UP-SS/UP-SSS
/
Electronic Grade
230kg
/
Plastic Drum
40%; EL/UP/UP-S/UP-SS: 49.0±0.5%
/
Electronic Grade
25kg
/
Plastic Drum
CAS:7664-93-9
Molecular Formula:H2SO4
Alias
More Information
Sulfur Acid; Sulphuric Acid; Oil Of Vitriol; Sulphur Acid; серная кислота; Sulphuric acid 98%; Concentrated Sulfuric acid; h2so4; 71760L8M50; Sulhpuric ACID; Sulphuric acid conc
Brief Introduction
Sulfuric acid is a colorless oily liquid. It is soluble in water with release of heat. It is corrosive to metals and tissue. It will char wood and most other organic matter on contact, but is unlikely to cause a fire. Density 15 lb / gal. Long term exposure to low concentrations or short term exposure to high concentrations can result in adverse health effects from inhalation. It is used to make fertilizers and other chemicals, in petroleum refining, in iron and steel production, and for many other uses.
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Ct Groups
pH: 1,2 at 5 g/l ； Melting Point: 3 °C ； Boiling Point: 290 °C (lit). ； Vapour pressure: 1,33 hPa at 145,8 °C ； Vapour density: 3,39 – (Air = 1.0) ； Relative density: 1,84 g/cm3 at 25 °C ； Water solubility: Miscible (with release of much heat)
/
Tech Grade
CAS:12069-32-8
Molecular Formula:CB4
Brief Introduction
Used for grinding, grinding, drilling and polishing of hard materials such as hard alloys and gems, manufacturing of metal borides, smelting sodium boron, boron alloys and special welding, etc.
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≥97%
/
Tech Grade
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