CAS:213697-53-1
Molecular Formula:C26H36NP
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Buchwald'S Davephos Ligand; (2'-Dicyclohexylphosphanyl-Biphenyl-2-Yl)-Dimethyl-Amine; N-[2'-(Dicyclohexylphosphino)-1,1'-Biphenyl-2-Yl]-N,N-Dimethylamine; 2'-(Dicyclohexylphosphino)-N,N-Dimethylbiphenyl-2-Amine; 2-Dimethylamino-2'-(Dicyclohexylphosphino)Biphenyl; 2-[2-(Dicyclohexylphosphanyl)Phenyl]-N,N-Dimethylaniline; 2'-(N,N-Dimethylamino)-2-(Dicyclohexylphosphino)Biphenyl; 2-(3-Methoxypropoxy)-5-Methylaniline; 2'-Dicyclohexylphosphino-2-(N,N-Dimethylamino)Biphenyl; Davephos; 2-Dicyclohexylphosphino-2'-(N,N-Dimethylamino)Biphenyl
Brief Introduction
As a ligand, it is used in Suzuki, Buchwald and other coupling reactions and substitution reactions
CAS:21436-03-3
Molecular Formula:C6H14N2
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(1S,2S)-Cyclohexane-1,2-Diamine; S-Dach; (+)-(S,S)-1,2-Diaminocyclohexane; (S,S)-(+)-1,2-Diaminocyclohexane; (S,S)-1,2-Diaminocyclohexane; (1S,2S)-1,2-Diaminocyclohexane; (1S)-Trans-1,2-Diaminocyclohexane
Brief Introduction
(1s, 2S) - (+) - 1,2-cyclohexanediamine can be used as a variety of chiral synthesis reagents. It is an organic synthesis intermediate and pharmaceutical intermediate. It can be used in laboratory research and development process and biochemical production process. It is mainly used as the intermediate of raw material oxaliplatin.
CAS:2155-96-6
Molecular Formula:C14H13P
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Diphenyl(Vinyl)Phosphine; Ethenyl(Diphenyl)Phosphane; Phosphine,Ethenyldiphenyl-; (Diphenylphosphino)Ethen; Diphenyl Vinylphosphane; Ethenyldiphenylphosphine; Vinyl-Diphenyl-Phosphine; Vinyldiphenylphosphine
CAS:21668-81-5
Molecular Formula:C4H10N2O3S2
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3-(Amidinothio)-1-Propanesulfonic Acid; Ups; 3-S-Isothiuronium Propane Sulfonate; 3-[(Amino-Iminomethyl)-Thio]-1-Propanesulfonic Acid; 3-S-Isothiuronium Propyl Sulfonate; 3-[(Aminoiminomethyl)Thio]Propanesulphonic Acid; 3-(Carbamimidoylthio)-1-Propanesulfonic Acid; 3-[(Aminoiminomethyl)Thio]-1-Propanesulfonic Acid
Brief Introduction
It can be used as an intermediate of electroplating additive, a brightener for copper plating, and other precious metal electroplating.
CAS:218151-78-1
Molecular Formula:C8H15IN2
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1,2-Dimethyl-3-Propyl-1H-Imidazol-3-Ium Iodide; 1,2-Dimethyl-3-Propylimidazolium Iodide; 1-Propyl-2,3-Dimethylimidazolium Iodide; 2,3-Dimethyl-1-Propylimidazolium Iodide; Dmpii; Pmmim I
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