Copper

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Copper

CAS NO.： 7440-50-8

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Product Detail

Properties

Sponge Copper Powder

English Name: Sponge Copper Powder

CAS No.: 7440-50-8

Molecular formula: Cu

Molecular weight: 63.55

EINECS No.: 231-159-6

Melting point: 1083.4 ° C (lit.)

Boiling point: 2567 ° C (lit.)

Density: 8.94 g / ml at 25 ° C (lit.)

Flash point: - 23 ° C

Usage: spongy copper is spongy copper. High grade sponge copper can be used to refine metal copper and make cuprous octanoate and other raw materials, as well as die casting.

Properties

Used for powder metallurgy parts, diamond saw blades, friction materials, electric carbon products and chemical catalysts

CAS No.

7440-50-8

Formula

Molecular Mass

63.54600

Exact Mass

62.92960

PSA

0.00000

Logp

-0.00250

IUPAC

copper

Matter Classification

organic

Category

Melting Point

1083.4 °C

Density

8.92 g/cm3

Boiling Point

2580 °C

Flash Point

-23 °C

Appearance

Copper is solid at room temperature, the new section is purplish red, and it is easy to oxidize when heated. Copper has excellent conductivity and thermal conductivity, good corrosion resistance, low deformation impedance, and can withstand high cold deformation without cracking

Acidity and Basicity

reducibility, neutral

HS Code

74020000

UN No.

3089

DG-Class

4.1

Risk Code

17-36/38-11-52/53-67-65-62-51/53-48/20-38-53-50/53-50-68/20/21/22-20/21/22

Safety Label

F,N,Xi,Xn